![]() It will discuss the challenges and trade-offs associated with optimizing design performance for technologies such as PCIe 6.0, USB4 Version 2.0, and USB-C, DDR5, and LPDDR. This eBook covers how to connect design workflows to make end-to-end high-speed digital design a reality. Engineers require close collaboration and seamless flows from concept to simulation, emulation, and testing to keep up with technology's pace and meet shrinking time-to-market expectations. High-speed digital links at 224 Gbps per lane, device miniaturization, and ultra-low power budgets result in sophisticated systems that are more complex to optimize signal integrity performance and reliability. The first article addresses the inter-relationships between jitter and other noise-generating mechanisms. This eBook focuses on jitter, simply defined as any effect that causes signal threshold crossing times to deviate from their expected positions. Getting the Jitter Out - High Speed Communications Timing Technology It is designed for both newcomers seeking a foundational knowledge of the subject and experienced professionals looking to deepen their expertise. This eBook provides an understanding of the underlying principles, practical methodologies, and advanced techniques for dealing with EMC/EMI challenges. Engineers, designers, and technicians must proactively identify and mitigate these issues to ensure that their products meet regulatory standards, perform reliably, and avoid costly setbacks. It's no longer sufficient to simply design and build electronic systems without considering their EMC/EMI characteristics. The user is therefore advised to take appropriate security precautions and to use a virus scanner prior to downloading software, documentation or information. As electronic devices become smaller, faster, and more powerful, the potential for interference grows exponentially. The need to address EMC/EMI problems has never been more pressing. “DesignCon Returns to January with New Offerings,” Suzanne Deffree.“Power Integrity Testing Requirements Introduce Extreme Interconnect Measures,” Steven Sandler.“Selecting a Backplane: PCB vs Cable Backplane for High-Speed Designs,” Andrew Josephson, Brandon Gore, and Jonathan Sprigler.“Avoiding GIGO with Field Solvers,” Bert Simonovich.“The Case for Split Ground Planes,” Eric Bogatin.“Understanding Via Impedance,” Donald Telian. ![]() “Ultra-Fine Line Differential Pair Design with No Return Plane,” Chaithra Suresh, Eric Bogatin, Melinda Piket-May, Paul Dennig, and Haris Basit. ![]()
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